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Industrial Ethernet Book 103

Industry news Microsoft demonstration walls highlight Azure Industrial IoT Microsoft partners with Hewlett Packard Enterprise (HPE), Honeywell, Mitsubishi, Rockwell, Siemens, Schneider, Beckhoff, Harting and Leuze showing the Microsoft “Connected Factory”. A purpose of the Azure IoT demonstration wall is to illustrate device-to-cloud and cloud-to-device connectivity. 6 industrial ethernet book 11.2017 SOURCE: OPC OPC FOUNDATION HAS DELIVERED the first “Azure IoT Suite Connected Factory” demonstration walls that will be displayed internationally at the Microsoft Technology Centers. These interactive walls demonstrate vendor devices from different verticals showing a bidirectional connection to Azure: • Device-to-Cloud (D2C): Devices push telemetry data to the Azure IoT platform • Cloud-to-Device (C2D): Allows secure browsing of rich OPC UA information model from Azure IoT platform and “command and control” machines Microsoft first demonstrated OPC UA integration into Azure IoT Suite at Hanover fair in April 2016. Over 30 companies participated by providing OPC UA enabled devices for an integrated Connected Factory demonstration. This Hanover demonstration was later turned into a decision by Microsoft and the OPC Foundation to actively promote the Connected Factory demonstration by developing freestanding OPC UA demonstration walls. The Connected Factory demonstrates the OPC UA technology as a solution for Industrial IoT, Industrie 4.0, Made in China 2025, Korea Manufacturing and other initiatives. Jason Zander, Corp. Vice President Microsoft Azure said during the opening ceremony of the Microsoft Innovation Center in Taiwan: “We see OPC UA as a critical standard for ensuring interoperability between manufacturing processes and equipment, spanning decades of investment for many companies. We have been working with the OPC Foundation on building up 40 OPC UA devices walls which are currently being distributed to the Microsoft Executive Briefing Center in Redmond, worldwide Microsoft Technology Centers, the IoT Labs in Redmond, Germany and China and the newly established IoT Innovation Center in Taiwan, to demonstrate the strong ecosystem with connected OPC UA devices and the Connected Factory preconfigured solution running on the Azure IoT platform.” News by Microsoft and OPC Foundation. THE IO-LINK COMMUNITY has founded a technical working group for specifying the integration of IO-Link into OPC UA based on existing use cases. The Industry 4.0 platform sees OPC UA as a suitable architecture model for implementing integration of IT on the field level. This is why a corresponding standard for a data and function model is being developed within the framework of the IO-Link community so as to accurately represent future IO-Link Devices and IO-Link Masters in OPC UA. This approach follows the general recommendation for developing OPC UA Companion Standards. Over the past few years, IO-Link as a pointto point protocol for sensors and actuators has been able to solidly establish itself and increase its presence. It is manufacturer independent (and thus field bus independent), has come to support more than 4,500 devices and enjoys steadily increasing acceptance. Through the use of corresponding logic, so-called “IO-Link Masters”, IO-Link sensors and actuators can be connected to the various different field bus systems without further adjustment. Such masters can even be economically integrated into simple devices today. IO-Link offers access to a very broad range of sensors and actuators in a standardized way and fieldbus independent. As Industrie 4.0 efforts progress, it is also necessary to semantically incorporate IO-Link Devices into systems on a higher level than the field bus in order to evaluate sensor data. This functionality is often designated as a “sensor to the cloud” to express that sensor data is analyzed by IT systems outside the automation process. In this way, sensor data can also be seamlessly linked to MES and ERP systems. News by OPC Foundation. Integration of IO-Link into OPC UA A final proposal for the companion specification is to be available before the end of 2018. SOURCE: OPC


Industrial Ethernet Book 103
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